YQuantum is a fast-growing startup pioneering scalable superconducting quantum technologies. This position is based atZurich Technopark, placing you at the center of Switzerland’s deep-tech ecosystem where you will operate at the intersection of deep engineering and rapid execution.
The Role
As technical Lead Hardware Engineer, you will lead CAD designand mechanical development of components for ultra-low-temperature cryogenic systems. You will drive the physical integration of critical RF components, manage parts procurement, and ensure the overall thermal and mechanical performance of our cryogenic hardware.
Key Responsibilities
Design, Integration, & Verification
Design and develop CAD models and mechanical componentsfor cryogenic systems, optimizing thermal performance and minimizing heat loads.
Integrate RF components into cryogenic assemblies with proper mechanical and thermal considerations.
Conduct cryogenic testing and verification of mechanical and RF performance.
Management & Documentation
Manage procurement of mechanical,PCBs, and RF parts.
Document designs, tests, and BOMs, and actively contribute to building out the hardware engineering team.
Qualifications
Foundation
Education: BSc or MSc in electrical, mechanical engineering, or equivalent expertise.
Mindset: Startup mentality, thrives in a fast-paced environment, adaptable, and takes initiative.
Core Expertise (Must-Haves)
Design: Strong experience with CAD software for mechanical design.
About YQuantum
YQuantum is a fast-growing startup pioneering scalable superconducting quantum technologies. This position is based at Zurich Technopark, placing you at the center of Switzerland’s deep-tech ecosystem where you will operate at the intersection of deep engineering and rapid execution.
The Role
As technical Lead Hardware Engineer, you will lead CAD designand mechanical development of components for ultra-low-temperature cryogenic systems. You will drive the physical integration of critical RF components, manage parts procurement, and ensure the overall thermal and mechanical performance of our cryogenic hardware.
Key Responsibilities
Design, Integration, & Verification
Design and develop CAD models and mechanical componentsfor cryogenic systems, optimizing thermal performance and minimizing heat loads.
Integrate RF components into cryogenic assemblies with proper mechanical and thermal considerations.
Conduct cryogenic testing and verification of mechanical and RF performance.
Management & Documentation
Manage procurement of mechanical, PCBs, and RF parts.
Document designs, tests, and BOMs, and actively contribute to building out the hardware engineering team.
Qualifications
Foundation
Education: BSc or MSc in electrical, mechanical engineering, or equivalent expertise.
Mindset: Startup mentality, thrives in a fast-paced environment, adaptable, and takes initiative.
Core Expertise (Must-Haves)
Design: Strong experience with CAD software for mechanical design.
Practical RF/Cryo: Demonstrated practical experience integrating RF/microwave components in cryogenic environments.
Hands-on: Hands-on experience with cryogenic measurements.
Nice to Have: Experience with thermal simulation software.
What We Offer
Impact: Direct ownership over the physical design and thermal management of our quantum systems.
Compensation: Attractive early-stage equity and competitive compensation.
Growth: Opportunity to shape the mechanical architecture and build out the engineering function for next-generation quantum hardware.