We are looking for an ambitious and results-oriented researcher with a strong background in semiconductor physics, electronics and process integration related to CMOS fabrication processes. As a researcher at VTT, you will have a key role in the development of 3D integration technologies for sensor matrices and for neuromorphic and quantum computing, with a personal research focus on one of these platforms. You identify and solve problems independently and creatively, while working closely and flexibly with a team of experts. You focus on the design and fabrication aspects of the process, especially in terms of 3D integration. You understand the big picture and participate in the concept development.
In this position, you have the opportunity to develop novel computing methods beyond CMOS and their integration to the microelectronics process flow in close collaboration with industry and international semiconductor foundries. Your work will have a connection to large European research initiatives Graphene Flagship and Quantum Flagship where VTT has a strong role, and will include integration with VTT’s core technologies in microelectronic sensor platforms, bio diagnostics, AI solutions and quantum computing.
With us, you will be responsible for:
– Development of the sensing or computing platform within your domain of expertise
– Development of the 3D process integration and post-CMOS processing, including techniques such as electroplating, CMP, wafer bonding and planarization
– Solving complex process integration challenges, introduction of new materials into the process flow
– Communicating and solving those issues in tight collaboration with others at VTT
– Communicating and solving problems with external partners
We expect you to have:
We are looking for a person with experience in semiconductor physics, applications related to sensors, memories, photonics, transistors, piezo-electronics or superconductors, and on CMOS fabrication processes (front-end or back end), and a master’s or PhD level degree in physics, materials science, photonics or electrical engineering, or other field connected closely to 3D integration. Your background and interests are primarily in the experimental work, although numerical modeling and practical programming skills are certainly welcome. You are proficient in English.
Ideally, your background includes the following:
– Master’s degree or Ph.D. in experimental physics, materials science, or a related field
– At least 4 years of experience in demanding process integration related to CMOS fabrication processes (front-end or back end) in microelectronics environment
– At least basic programming skills
As a person, you strive for excellent results but also prioritize and make pragmatic choices. You are focused and systematic. You contribute to a positive team spirit and prioritize the needs of the team. You are hard working but you also communicate, collaborate, and delegate effectively. You are eager to work with new topics with open-minded and curious attitude. You are able to bring clarity over complexity and identify the essential bottlenecks. In addition, you have the ability and patience to tolerate uncertainty and unexpected outcomes.
VTT provides an inspiring working environment that pools together world-class research, innovations and top experts. Our mission is to create impact that generates sustainable growth and wellbeing in society as well as in industry.
Our people are the core of the next generation VTT. Therefore, our personnel’s wellbeing, flexible work opportunities and competence development are key priorities for us. With us, you can make an impact for a better future and you can be part of solving the biggest challenges of our time
For further information:
Interested and want to know more? Contact Sanna Arpiainen for more information during July by e-mail: email@example.com or during August by e-mail or phone: +358405378924. Please note that in July responses may be delayed due to holiday season.
To apply, please send your cover letter and CV as soon as possible, latest by August 31. We will start interviews already during application period.
How to apply
To apply, please send your cover letter and CV as soon as possible, latest by August 31 using our online recruitment system. We will start interviews already during application period.
Published on July 16, 2020