Bringing solutions to quantum communications by providing on-chip quantum devices for quantum integrated photonic circuits to enable secure communication protocols, scaling of quantum computers, and development of novel quantum sensing applications.
The proposed project aims at developing scalable quantum networks, based on photonic chip integration of novel 2D material quantum devices, with the main goal to demonstrate all-optical on-chip quantum processing. The recent demonstration of effortless integration of 2D materials onto photonics and CMOS platforms will result in a breakthrough in the development of on-chip quantum networks. 2D-SIPC will take full advantage of the huge variety of 2D materials and heterostructures and prototype novel quantum devices with revolutionary functionalities. In particular, we will develop electrically driven and entangled single-photon emitters, broadband, and high-temperature single-photon detectors, ultra-fast waveguide integrated optical modulators, and non-linear gates. To pave the way to scalable networks, 2D-SIPC will develop large-scale growth techniques of the most promising 2D materials. This unique combination of features will allow the first demonstration of on-chip optical quantum processing, a key milestone for many quantum network concepts, such as extended secure quantum communication, scaling up of quantum computers and simulators, and novel quantum sensing applications with entangled photons. In particular, as these topics cover all four Quantum Technology pillars of the Quantum Flagship, our proposal makes a strong strategic link to each one of them. Beyond the 2D-SIPC platform, each developed component will be exploited in such distant fields as biological and medical imaging, radio-astronomy, and environmental monitoring.
The 2D-SIPC consortium includes four academic and one industrial partner with a high degree of complementarity that is at the forefronts of their fields, including single-photon detection (ICFO), theory and fabrication of 2D materials and their heterostructures (UNIMAN), single-photon emission (UCAM), chip-based photonic circuits (CNIT) and commercial single-photon detection, single-photon emission and packaging (SQ).
This project has received funding from the European Union’s Horizon 2020 research and innovation program under grant agreement No820378.